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Produktbild: Failure Analysis of Integrated Circuits
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Failure Analysis of Integrated Circuits Tools and Techniques

Aus der Reihe Springer International Series in Engineering and Computer
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139,99 € UVP 160,49 €

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Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

31.01.1999

Abbildungen

XIII, 255 p.

Herausgeber

Lawrence C. Wagner

Verlag

Springer Us

Seitenzahl

255

Maße (L/B/H)

24,1/16/2 cm

Gewicht

582 g

Auflage

1999

Sprache

Englisch

ISBN

978-0-412-14561-2

Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

31.01.1999

Abbildungen

XIII, 255 p.

Herausgeber

Lawrence C. Wagner

Verlag

Springer Us

Seitenzahl

255

Maße (L/B/H)

24,1/16/2 cm

Gewicht

582 g

Auflage

1999

Sprache

Englisch

ISBN

978-0-412-14561-2

Herstelleradresse

Springer-Verlag KG
Sachsenplatz 4-6
1201 Wien
AT

Email: ProductSafety@springernature.com

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  • Produktbild: Failure Analysis of Integrated Circuits
  • 1 Introduction.- 1.1 Electrical Characterization.- 1.2 Die Exposure.- 1.3 Fail Site Isolation.- 1.4 Package Analysis.- 1.5 Physical and Chemical Analysis.- 1.6 Diagnostic Activities.- 1.7 Root Cause and Corrective Action.- 1.8 Conclusion.- 2 Electrical Characterization.- 2.1 Electrical Characterization.- 2.2 Curve Tracing.- 2.3 Electrical Characterization of State Dependent Logic Failures.- 2.4 Memory Functional Failures.- 2.5 Challenges of Analog Circuit Fault Isolation and Analog Building Blocks.- 2.6 Future Challenges for Circuit Characterization.- 3 Package Analysis: SAM and X-ray.- 3.1 The Scanning Acoustic Microscope.- 3.2 The Real-Time X-Ray Inspection System.- 3.3 Application Examples.- 3.4 Summary and Trends in Nondestructive Inspection.- 4 Die Exposure.- 4.1 Didding Cavity Packages.- 4.2 Decapsulation of Plastic Packages.- 4.3 Alternative Decapsulation Methods.- 4.4 Backside Preparation for Characterization and Analysis.- 4.5 Future Requirements.- 5 Global Failure Site Isolation: Thermal Techniques.- 5.1 Blackbody Radiation and Infrared Thermography.- 5.2 Liquid Crystals.- 5.3 Fluorescent Microthermal Imaging.- 5.4 Conclusion.- 6 Failure Site Isolation: Photon Emission Microscopy Optical/Electron Beam Techniques.- 6.1 Photon Emission Microscopy.- 6.2 Active Photon Probing.- 6.3 Active Electron Beam Probing.- 6.4 Future Developments for Photon and Electron Based Failure Analysis.- 7 Probing Technology for IC Diagnosis.- 7.1 Probing Applications and Key Probing Technologies.- 7.2 Mechanical Probing.- 7.3 E-beam Probing.- 7.4 Navigation and Stage Requirements.- 7.5 FIB for Probing and Prototype Repair.- 7.6 Backside Probing for Flip Chip IC.- 8 Deprocessing.- 8.1 IC Wafer Fabrication.- 8.2 Deprocessing Methods.- 8.3 New Challenges.- 9 Cross-section Analysis.- 9.1Packaged Device Sectioning Techniques.- 9.2 Wafer Cleaving.- 9.3 Die Polishing Techniques.- 9.4 Cross Section Decoration: Staining.- 9.5 Focused Ion Beam (FIB) Techniques.- 9.6 Sectioning Techniques for TEM Imaging.- 9.7 Future Issues.- 10 Inspection Techniques.- 10.1 Microscopy.- 10.2 Optical Microscopy.- 10.3 Scanning Electron Microscopy.- 10.4 Focused Ion Beam Imaging.- 10.5 Transmission Electron Microscopy.- 10.6 Scanning Probe Microscopy.- 10.7 Future Considerations.- 11 Chemical Analysis.- 11.1 Incident Radiation Sources.- 11.2 Radiation-Sample Interaction.- 11.3 Radiation Flux.- 11.4 Detectors.- 11.5 Common Analysis Techniques.- 11.6 Microspot FTIR.- 11.7 Other Techniques.- 11.8 Conclusion.- 12 Energy Dispersive Spectroscopy.- 12.1 Characteristic X-Ray Process and Detection.- 12.2 Quantitative Analysis.- 12.3 Sample Considerations.- 12.4 EDS Applications.- 12.5 Future Considerations.- 13 Auger Electron Spectroscopy.- 13.1 The Auger Electron Process.- 13.2 AES Instrumentation and Characteristics.- 13.3 AES Data Collection and Analysis.- 13.4 Specimen, Material, and AES Operational Concerns.- 13.5 AES in Failure Analysis.- 13.6 Conclusion.- 14 Secondary Ion Mass Spectrometry, SIMS.- 14.1 Basic SIMS Theory and Instrumentation.- 14.2 Operational Modes, Artifacts, and Quanitification.- 14.3 Magnetic Sector SIMS Applications.- 14.4 Quadrupole SIMS Applications.- 14.5 Time-of-Flight SIMS Applications.- 14.6 Future SIMS Issues.- 15 Failure Analysis Future Requirements.- 15.1 IC Technology Trends Driving Failure Analysis.- 15.2 Global Failure Site Isolation.- 15.3 Development in Probing.- 15.4 Deprocessing Difficulties.- 15.5 Defect Inspection - A Time vs. Resolution Tradeoff.- 15.6 Failure Analysis Alternatives.- 15.7 Beyond the Roadmap.