Produktbild: Mechanics of Microelectronics
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Mechanics of Microelectronics

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Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

22.11.2010

Abbildungen

XIV, 566 p.

Verlag

Springer Netherland

Seitenzahl

566

Maße (L/B/H)

23,5/15,5/3,2 cm

Gewicht

873 g

Auflage

1. Auflage

Sprache

Englisch

ISBN

978-90-481-7231-3

Beschreibung

Rezension

From the reviews:



"This is an introductory treatise on the mechanism of microelectronics that has penetrated into every aspects of human life for the past half of a century. … The treatise should be of interest to both the academia and industry, and it can be used as a ‘basic source for teaching’ in a graduate course. … In sum, the authors have done a valuable service in presenting the title topic to researchers, engineers and students interested in the mechanics of microelectronics." (M. Cengiz Dökmeci, Zentralblatt MATH, Vol. 1105 (7), 2007)


"The editors of Mechanics of Microelectronics present this book, as their obligation, to graduate students in universities, researchers, engineers and managers in industries. … The book chapters are written by the worldwide leading experts with both profound theoretical achievement and rich industrial experience … . The book will be eagerly sought after by microelectronics and microsystems design engineers; process/product development engineers; reliability engineers; thermal, mechanical and multi-physics analysts; researchers, graduates and PhD students and their guides." (Current Engineering Practice, 2007)

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

22.11.2010

Abbildungen

XIV, 566 p.

Verlag

Springer Netherland

Seitenzahl

566

Maße (L/B/H)

23,5/15,5/3,2 cm

Gewicht

873 g

Auflage

1. Auflage

Sprache

Englisch

ISBN

978-90-481-7231-3

Herstelleradresse

Springer-Verlag KG
Sachsenplatz 4-6
1201 Wien
AT

Email: ProductSafety@springernature.com

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  • Produktbild: Mechanics of Microelectronics
  • Microelectronics Technology.- Reliability Practice.- Thermal Management.- to Advanced Mechanics.- Thermo-Mechanics of Integrated Circuits and Packages.- Characterization and Modelling of Moisture Behaviour.- Characterization and Modelling of Solder Joint Reliability.- Virtual Thermo-Mechanical Prototyping.- Challenges and Future Perspectives.