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  • Produktbild: Circuit Design for RF Transceivers
  • Produktbild: Circuit Design for RF Transceivers

Circuit Design for RF Transceivers

215,99 €

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Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

14.12.2011

Abbildungen

XXV, 83 illus., schwarz-weiss Illustrationen

Verlag

Springer Us

Seitenzahl

323

Maße (L/B/H)

23,5/15,5/2 cm

Gewicht

539 g

Auflage

2001

Sprache

Englisch

ISBN

978-1-4419-4920-2

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

14.12.2011

Abbildungen

XXV, 83 illus., schwarz-weiss Illustrationen

Verlag

Springer Us

Seitenzahl

323

Maße (L/B/H)

23,5/15,5/2 cm

Gewicht

539 g

Auflage

2001

Sprache

Englisch

ISBN

978-1-4419-4920-2

Herstelleradresse

Springer-Verlag KG
Sachsenplatz 4-6
1201 Wien
AT

Email: GPSR Kontakt

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  • Produktbild: Circuit Design for RF Transceivers
  • Produktbild: Circuit Design for RF Transceivers
  • 1. RF Design: Concepts and Technology 1.1 RF Specifications 1.1.1 Gain 1.1.2 Noise 1.1.3 Non-Linearity 1.1.4 Sensitivity 1.2 RF Device technology 1.2.1 Characterization and Modeling, Modeling, Cut-off Frequency, Maximum Oscillation Frequency, Input Limited Frequency, Output Limited Frequency, Maximum Available Bandwidth 1.2.2 Technology Choice, Double Poly Devices, Silicon-on-Anything, Comparison, SiGe Bipolar Technology, RF CMOS (updated for newer processes) 1.3 Passives 1.3.1 Resistors 1.3.2 Capacitors (updated for different layouts) 1.3.3 Planar Monolithic Inductors (updated as relation to newer processes) References (updated) 2. Antennas, Interface and substrate 2.1 Antennas 2.2 Bond wires 2.3 Transmission Lines 2.3.1 General Theory 2.3.2 Impedance Matching using Transmission Lines 2.3.3 Microstrip Lines and coplanar Lines 2.4 Bond Pads and ESD Devices 2.4.1 Bond Pads 2.4.2 ESD Devices, ggNMOST ESD Device, pn and np-diode ESD Device (updated for newer processes and detailed scaling effects) 2.5 Substrate 2.5.1 Substrate bounces 2.5.2 Design Techniques to Reduce the substrate bounce References (updated) 3. Low Noise Amplifiers 3.1 Specifications 3.2 Bipolar LNA designs 3.2.1 DCS applications in SOA, Design of the LNA, Measurements 3.2.2 Broadband LNA (new) 3.3 CMOS LNA Design 3.3.1 Single Transistor LNA, Design Steps, Simulation and Measurements 3.3.2 Classical LNA Design, The Design, Measurement Results 3.3.3 Broadband LNA (new) 3.4 Evaluation References (updated) 4. Mixers 4.1 Specification 4.2 Bipolar Mixer Design 4.3 CMOS mixers 4.3.1 Active CMOS mixer 4.3.2 Passive CMOS mixer, 1/f-Noise in mixer transistors, 1/f-Noise due to IF amplifier, 1/f-noise due to Switched-Capacitor Behavior 4.3.3 Concluding remarks References (Updated) 5. Case study Receiver front-ends (new) 5.1 Bluetooth (new) 5.2 IEEE 802.11a Standard (new) 6. RF Power Amplifier 6.1 Specification 6.1.1 Efficiency 6.1.2 Generic Amplifier Classes 6.1.3 Heating 6.1.4 Linearity 6.1.5 Ruggedness 6.2 Bipolar PA design 6.3 CMOS PA Design 6.4 Linearization Principles 6.4.1 Predistortion Technique 6.4.2 Phase-Correcting feedback 6.4.3 Envelope Elimination and Restoration (EER) 6.4.4 Cartesian Feedback 6.5 Case study: Bluetooth PA (new) References (updated) Note: Oscillator chapter: errors removed and updated throughout, sub-section headings probably quite similar but to be defined 7. Oscillators 7.1 Introduction 7.2 Specifications 7.3 LC oscillator 7.4 Ring oscillators 7.5 Phase noise modelling and simulation (new) 7.6 Typical oscillator performance (new) 7.7 Oscillator case studies (new), Wide range oscillators for mobile applications, Oscillators for ultra low-power wireless links, 10GHz CMOS VCO for WLAN, 10GHz QuBIC VCO for Satellite References (updated) 8. Frequency Synthesizers 8.1 Introduction 8.2 Integer-N PLL Architecture 8.3 Tuning System Specifications 8.3.1 Tuning Range 8.3.2