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  • Produktbild: Moisture Sensitivity of Plastic Packages of IC Devices
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Moisture Sensitivity of Plastic Packages of IC Devices

Aus der Reihe Micro- and Opto-Electronic Materials, Structures, and Systems
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234,99 € UVP 267,49 €

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Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

05.09.2012

Herausgeber

X.J. Fan + weitere

Verlag

Springer Us

Seitenzahl

558

Maße (L/B/H)

23,5/15,5/3,2 cm

Gewicht

879 g

Auflage

2010

Sprache

Englisch

ISBN

978-1-4614-2625-7

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

05.09.2012

Herausgeber

Verlag

Springer Us

Seitenzahl

558

Maße (L/B/H)

23,5/15,5/3,2 cm

Gewicht

879 g

Auflage

2010

Sprache

Englisch

ISBN

978-1-4614-2625-7

Herstelleradresse

Springer-Verlag KG
Sachsenplatz 4-6
1201 Wien
AT

Email: GPSR Kontakt

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  • Produktbild: Moisture Sensitivity of Plastic Packages of IC Devices
  • Produktbild: Moisture Sensitivity of Plastic Packages of IC Devices
  • Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-Induced Damages in Polymeric Materials in Electronic Packaging.- Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds.- Real-Time Characterization of Moisture Absorption and Desorption.- Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices.- Characterization of Hygroscopic Deformations by Moiré Interferometry.- Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques.- Hygroscopic Swelling of Polymeric Materials in Electronic Packaging: Characterization and Analysis.- Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages.- Methodology for Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of IC Packages.- Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application and Extension of the Theory of Thin Plates of Large Deflections.- Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices.- Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices.- New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels.- Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages.- Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages.- Industrial Applications of Moisture-Related Reliability Problems.- Underfill Selection Against Moisture in Flip Chip BGA Packages.- Moisture Sensitivity Investigations of 3D Stacked-Die Chip-Scale Packages (SCSPs).- Automated Simulation System of Moisture Diffusion and Hygrothermal Stress for Microelectronic Packaging.- Moisture-Driven Electromigrative Degradation in Microelectronic Packages.- Interfacial Moisture Diffusion: Molecular Dynamics Simulation and Experimental Evaluation.