Structural Dynamics of Electronic and Photonic Systems
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Form:Einzelkauf Download
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Sprache:Englisch
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eBook Format:ePUB
- PDF 172,99 €
- ePUB 172,99 € ausgewählt
172,99 €
inkl. gesetzl. MwSt.Beschreibung
Produktdetails
Format
ePUB
Kopierschutz
Ja
Family Sharing
Nein
Text-to-Speech
Ja
Erscheinungsdatum
04.04.2011
Herausgeber
Ephraim Suhir + weitereVerlag
John Wiley & Sons IncSeitenzahl
608 (Printausgabe)
Dateigröße
42599 KB
Auflage
1. Auflage
Sprache
Englisch
EAN
9780470886793
The proposed book will offer comprehensive and versatile
methodologies and recommendations on how to determine dynamic
characteristics of typical micro- and opto-electronic structural
elements (printed circuit boards, solder joints, heavy devices,
etc.) and how to design a viable and reliable structure that would
be able to withstand high-level dynamic loading. Particular
attention will be given to portable devices and systems designed
for operation in harsh environments (such as automotive, aerospace,
military, etc.) In-depth discussion from a mechanical
engineer's viewpoint will be conducted to the key components'
level as well as the whole device level. Both theoretical
(analytical and computer-aided) and experimental methods of
analysis will be addressed. The authors will identify how the
failure control parameters (e.g. displacement, strain and stress)
of the vulnerable components may be affected by the external
vibration or shock loading, as well as by the internal parameters
of the infrastructure of the device. Guidelines for material
selection, effective protection and test methods will be developed
for engineering practice.
methodologies and recommendations on how to determine dynamic
characteristics of typical micro- and opto-electronic structural
elements (printed circuit boards, solder joints, heavy devices,
etc.) and how to design a viable and reliable structure that would
be able to withstand high-level dynamic loading. Particular
attention will be given to portable devices and systems designed
for operation in harsh environments (such as automotive, aerospace,
military, etc.) In-depth discussion from a mechanical
engineer's viewpoint will be conducted to the key components'
level as well as the whole device level. Both theoretical
(analytical and computer-aided) and experimental methods of
analysis will be addressed. The authors will identify how the
failure control parameters (e.g. displacement, strain and stress)
of the vulnerable components may be affected by the external
vibration or shock loading, as well as by the internal parameters
of the infrastructure of the device. Guidelines for material
selection, effective protection and test methods will be developed
for engineering practice.
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