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Produktbild: Particles on Surfaces 3

Particles on Surfaces 3 Detection, Adhesion, and Removal

146,99 €

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Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

18.07.2013

Abbildungen

VIII, 328 p.

Herausgeber

K.L. Mittal

Verlag

Springer Us

Seitenzahl

328

Maße (L/B/H)

25,4/17,8/1,9 cm

Gewicht

641 g

Auflage

1991

Sprache

Englisch

ISBN

978-1-4899-2369-1

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

18.07.2013

Abbildungen

VIII, 328 p.

Herausgeber

K.L. Mittal

Verlag

Springer Us

Seitenzahl

328

Maße (L/B/H)

25,4/17,8/1,9 cm

Gewicht

641 g

Auflage

1991

Sprache

Englisch

ISBN

978-1-4899-2369-1

Herstelleradresse

Springer-Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

Email: ProductSafety@springernature.com

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  • Produktbild: Particles on Surfaces 3
  • I. Particle-Surface Interactions, Adhesion and General Papers.- Relevance of Surface Energetics to Departiculation of Disk Drive Substrates.- Particle Adhesion to Surface Under Turbulent Flow Conditions.- Modelling Particle Accumulation on a Filter Surface.- Particles in ULSI Grade Chemicals and Their Adhesion to Silicon Surfaces.- Evaluation of Polymeric Materials Used in the Manufacture of Disk Handling Cassettes.- The Release of Particles During Spaceflight.- II. Particle detection, identification, analysis and characterization.- Statistical Aspects of Surface Particle Counting.- Light Scattering by Submicron Spherical Particles on Semiconductor Surfaces.- BRDF Measurements and Mie Scattering Analysis of Spherical Particles on Optical Surfaces.- Identification of Surface Contaminants Using Infrared Micro-profiling.- Analysis of Particles on Surfaces by Total Reflection X-ray Fluorescence Spectrometry.- Characterization of Surface Metal Particulate Contamination Using the Polysilicon Chemical Vapor Deposition Process.- Detection and Subsequent Reduction of Surface Particle Induced Defects on Silicon Wafers.- Isolation and Characterization of Particle Induced Defects from the Lithography Process Using an Electrical Defect Monitor.- III. Particle Reduction and Removal.- Reducing Uncertainties in Particle Adhesion and Removal Measurements.- Particulate and Defect Reduction Strategies for Semiconductor Devices: Tools and Methodologies.- Ultrasonic Cleaning of Surfaces: An Overview.- Particle Protection of Semiconductor Surfaces by Reversible Wafer Bonding and Related Concepts.- Ultra-Clean Air Ionizers for Suppression of Particulate Surface Contamination.- The Cold Jet Process — An Environmentally Sound Alternative for Particles Removal From Advanced Substrates.-Identification and Removal of Storage Induced Particle Contamination on Silicon Wafer Surfaces.- Particle Removal from Oxide, Nitride, and Bare Silicon Surfaces Using Direct-Displacement Isopropyl Alcohol (IPA) Drying.- Elimination of Fretting Wear Particles from the Surface of a Power Cable on a Disk Drive Actuator: A Case Study.- Scanning UV Laser Removal of Contaminants from Semiconductor and Optical Surfaces.- About the Contributors.