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Produktbild: Cyber-Physical System Design from an Architecture Analysis Viewpoint
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Cyber-Physical System Design from an Architecture Analysis Viewpoint Communications of NII Shonan Meetings

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Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

09.12.2018

Abbildungen

XIV, 52 illus., 32 illus. in color., schwarz-weiss Illustrationen, farbige Illustrationen

Herausgeber

Shin Nakajima + weitere

Verlag

Springer Singapore

Seitenzahl

159

Maße (L/B/H)

23,5/15,5/1 cm

Gewicht

277 g

Auflage

Softcover reprint of the original 1st edition 2017

Sprache

Englisch

ISBN

978-981-13-5136-5

Beschreibung

Portrait

Editors:

Shin Nakajima is a professor at the National Institute of Informatics (NII) and also a professor at the Graduate University for Advanced Studies (SOKENDAI). His research interests include formal methods, automated verification, and software testing.

Jean-Pierre Talpin is a senior research associate (directeur de recherche) with Inria and leads Inria project-team TEA (time, events and architectures).  His research background ranges from type theory, programming languages, concurrency theory, code generation, scheduling, and verification to proof.  His current research interests include the component-based design, analysis, verification, and integration of cyber-physical systems.

Masumi Toyoshima is a research project manager at DENSO Corporation. His research background includes design of distributed computing systems and recent interest is Systems Engineering.

Huafeng Yu is a senior researcher with Boeing Research & Technology. He serves onIEEE Technical Committee on for Cyber-Physical Systems. His research interests include mobile autonomous systems, software architecture and safety, model-based engineering, and software certification.

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

09.12.2018

Abbildungen

XIV, 52 illus., 32 illus. in color., schwarz-weiss Illustrationen, farbige Illustrationen

Herausgeber

Verlag

Springer Singapore

Seitenzahl

159

Maße (L/B/H)

23,5/15,5/1 cm

Gewicht

277 g

Auflage

Softcover reprint of the original 1st edition 2017

Sprache

Englisch

ISBN

978-981-13-5136-5

Herstelleradresse

Springer-Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

Email: GPSR Kontakt

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  • Produktbild: Cyber-Physical System Design from an Architecture Analysis Viewpoint
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