Fog Computing for Healthcare 4.0 Environments Technical, Societal, and Future Implications

Dr. Sudeep Tanwar is an Associate Professor in the Computer Science and Engineering Department at Institute of Technology, Nirma University, Ahmedabad, Gujarat, India. He is visiting Professor in Jan Wyzykowski University in Polkowice, Poland and University of Pitesti in Pitesti, Romania. He received B.Tech in 2002 from Kurukshetra University, India, M.Tech (Honor’s) in 2009 from Guru Gobind Singh Indraprastha University, Delhi, India and Ph.D. in 2016 with specialization in Wireless Sensor Network. He has authored or coauthored more than 130 technical research papers published in leading journals and conferences from the IEEE, Elsevier, Springer, Wiley, etc. Some of his research findings are published in top cited journals such as IEEE Transactions on TVT, IEEE-Transactionss on Network Science and Engineering, IEEE Transactions on Industrial Informatics, Computer Communications, IEEE Networks, IEEE Wireless Communications, Applied Soft Computing, Journal of Network and Computer Application, Pervasive and Mobile Computing, International Journal of Communication System, Telecommunication System, Computer and Electrical Engineering and IEEE Systems Journal. He has also published six edited/authored books with International/National Publishers like IET, Springer. He has guided many students leading to M.E./M.Tech and guiding students leading to Ph.D. He is Associate Editor of IJCS, Wiley and Security and Privacy Journal, Wiley. His current interest includes Wireless Sensor Networks, Fog Computing, Smart Grid, IoT, and Blockchain Technology. He was invited as Guest Editors/Editorial Board Members of many International Journals, invited for keynote Speaker in many International Conferences held in Asia and invited as Program Chair, Publications Chair, Publicity Chair, and Session Chair in many International Conferences held in North America, Europe, Asia and Africa. He has been awarded best research paper awards from IEEE GLOBECOM 2018, IEEE ICC 2019, and Springer ICRIC-2019.